FlipFET MOSFET Design for High Volume SMT Assembly
نویسندگان
چکیده
International Rectifier has used a proprietary technique to position all the terminals of a HEXFET device on the same face of the die. This has enabled the development of wafer scale packaged MOSFETs. We're calling the technology platform the FlipFET MOSFET, and we are using it to offer surface mount products with the lowest RDS(on) per footprint area in the industry. This paper introduces the form factor and outlines design considerations. Specific guidelines for use and initial product performance are then discussed.
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